发明名称 Printed circuit board capable of preventing electrical short during soldering process
摘要 A printed circuit board containing pin-through holes includes components for mounting on the printed circuit board to be electrically connected with the printed circuit board, wherein each of the components includes a plurality of pins for inserting into the pin-through holes, patterns formed on the printed circuit board, wherein the patterns are located adjacent to a last one hole among the arranged pin-through holes, and at least one zone formed on at least one of the patterns, wherein a surface of the at least one zone is capable of being soldered, and wherein the at least one zone is formed on the same line passing through the plurality of pins and to absorb an excess amount of the solder at the last one hole, which prevents an electrical short due to the excess solidification of the solder at the last solder.
申请公布号 US6407342(B1) 申请公布日期 2002.06.18
申请号 US20000522844 申请日期 2000.03.10
申请人 SAMSUNG ELECTRONICS CO., LTD 发明人 LEE SUNG-MO;JEONG MYUNG-HWA
分类号 H05K1/11;H05K3/34;(IPC1-7):H05K1/16 主分类号 H05K1/11
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