| 摘要 |
Image data is edge-processed and then digitized. This image data is Hough-transformed to generate a parameter plane in which multiple Hough-curves are plotted in a parameter space, from which coordinates with multiple intersected Hough-curves are extracted and grouped. For each group, representative coordinates are selected to estimate slopes of linear components in the image data. In this way, the linear components can be recognized from the image data to estimate the slope, thereby making it possible to modify slopes of linear components in image data of a semiconductor wafer taken at an arbitrary angle or the like.
|
