| 摘要 |
The present invention relates to a chip quartz oscillator. In an embodiment of a chip quartz oscillator S in accordance with the present invention, a quartz oscillator 2, which has a detection electrode 3 on a surface thereof and a non-detection electrode on the other surface thereof, is fixed on a substrate 1, and each of the electrodes is connected electrically to a terminal 4 or 4 ' on the substrate 1. While keeping the non-detection electrode in contact with the substrate 1, the quartz oscillator 2 is fixed on the substrate 1, by flexibly bonding the side-wall 2 ''' of the quartz oscillator 2 along its circumference to the surface of the substrate 1 by using the elastic bonding agent 5. Thus, the oscillation surface of the quartz oscillator 2 is supported distributively on the substrate 1 in a surface-contacting and non-adhesive manner. |
