| 摘要 |
PROBLEM TO BE SOLVED: To form a desired surface shape at a favorable precision by suppressing the waving of a resin layer. SOLUTION: A photo-sensitive resin composition layer 21 is formed between the surface of a base material 10 and a molding die 32. Then, the photo-sensitive resin composition layer is hardened by casting light 33 to the photo-sensitive resin composition layer. Thus, a resin layer comprising the hardened substance of the photosensitive resin composition is formed. Then, the resin layer is demolded from the molding die. The irradiation of the light to expose the resin composition is performed while the temperature variation of at least either one of the base material, the molding die and the photo-sensitive resin composition is kept at±0.5 deg.C or lower.
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