发明名称 Unsupported chemical mechanical polishing belt
摘要 A belt for polishing a workpiece such as a semiconductor wafer in a chemical mechanical polishing system includes a polymeric layer forming an endless loop and having a polishing surface on one side of the endless loop. The belt is manufactured by molding a polymeric material such as urethane in a cylindrical mold. The belt is thus made from a single layer, reducing weight, size, cost and maintenance requirements.
申请公布号 US6406363(B1) 申请公布日期 2002.06.18
申请号 US19990386741 申请日期 1999.08.31
申请人 LAM RESEARCH CORPORATION;PERIPHERAL PRODUCTS, INC. 发明人 XU CANGSHAN;LOMBARDO BRIAN S.
分类号 B24B21/00;B24B37/00;B24B37/04;B24D7/12;B24D11/00;B24D18/00;H01L21/304;(IPC1-7):B24B21/00 主分类号 B24B21/00
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