Semiconductor and flip chip packages and method having a back-side connection

摘要

A semiconductor chip package having a back side connection and method of manufacture. The semiconductor chip package can combine industry standard die having conductive back sides with flip chip bump bonding to provide discrete and integrated devices that require less space on a printed circuit board. The chip packages can include a die connected by front side bond pads to a substrate. The substrate includes terminals opposite the side facing the die that electrically connect to contact pads on the opposite side of the substrate by way of vias. In one embodiment, the vias are buried in the substrate. The substrate contact pads connect to bond pads on the front side of the die. The back side of the die is electrically connected to a bond pad (and thereby to the terminal through the via) using a conductive substance that can cascade from the back side of the die to the bond pad. Solder balls can be attached to the terminals to provide solder connections to a printed circuit board. An insulating coating can be applied to the die between the conductive substance and the edge of the die along which the conductive substance cascades. In an alternative embodiment, the substrate is eliminated and the conductive substance directly connects the die back side to a printed circuit board.