| 发明名称 |
METHOD OF PREPARING AN ELECTRONIC PACKAGE BY CO-CURING ADHESIVE AND ENCAPSULANT |
| 摘要 |
<p>A semi-conductor package in which an integrated circuit chip is connected to a substrate using wire-bonding is prepared by curing the die attach adhesive and encapsulating the wire bonds in one heating step. The encapsulant composition has a curing chemistry and a curing profile compatible with those of the adhesive.</p> |
| 申请公布号 |
SG89283(A1) |
申请公布日期 |
2002.06.18 |
| 申请号 |
SG19990002969 |
申请日期 |
1999.06.18 |
| 申请人 |
NATIONAL STARCH AND CHEMICAL INVESTMENT HOLDING CORPORATION |
发明人 |
CHRISTOPHER J. DOMINIC |
| 分类号 |
H01L21/50;H01L21/56;H01L21/58;H01L23/04;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/50 |
| 代理机构 |
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| 地址 |
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