发明名称 THICK FILM TYPE THERMAL HEAD AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve boring characteristics to a stencil printing plate base paper by reducing a thickness irregularity of a heating resistor and reducing an unevenness of heating characteristics of heating regions in a thick film type thermal head having the heating resistor embedded in a linear groove part. SOLUTION: In cutting the linear groove part 11 to a surface of a substrate 10 with the use of a rotary whetstone, bumps and dents of the surface of the substrate 10 are detected and, upper and lower positions of the rotary whetstone are controlled in accordance with the bumps and dents. Therefore, even when the surface of the substrate 10 include bumps and dents, a cutting depth h of the linear groove part 11 can be maintained almost constant, so that the thickness irregularity of the heating resistor 14 which is to be embedded in the linear groove part 11 can be reduced and the unevenness of heating characteristics of heating regions which are to be formed between electrodes 15 and 16 can be reduced.
申请公布号 JP2002172810(A) 申请公布日期 2002.06.18
申请号 JP20000372746 申请日期 2000.12.07
申请人 RISO KAGAKU CORP 发明人 IMAI RYOICHI
分类号 B41J2/335;B41J2/345;(IPC1-7):B41J2/335 主分类号 B41J2/335
代理机构 代理人
主权项
地址