| 摘要 |
PURPOSE: Provided is a silicon composition cured at ordinary temperature, which is excellent in tensile stress, elongation, hardness, and heat storage ability and keeps the initial curing rate. CONSTITUTION: The silicon composition is produced by a process comprising the steps of: mixing 50-65pts.wt. of a polysiloxane(formula 1), of which the both sides are modified by hydroxy, having a molecular weight of 75,000-140,000 and 25-35pts.wt. of a non-reactive polysiloxane(formula 3) having a molecular weight of 1,200-7,000 and then adding 3.4-6.0pts.wt. of a crosslinking agent(formula 2) under nitrogen, wherein the crosslinking agent(formula 2) is at least three selected from methyl tris(methyl ethyl ketoxymo)silane, ethyl tris(methyl ethyl ketoxymo)silane, vinyl tris(methyl ethyl ketoxymo)silane, methyl methoxy bis(methyl ethyl ketoxymo)silane, and tetrakis(methyl ethyl ketoxymo)silane; mixing the resultant and 0.1-1.9pts.wt. of a coupling agent, and 0.01-0.1pts.wt. of a catalyst under nitrogen and stirring for 10-30min and then mixing and dispersing 5-10pts.wt. of a filler by 3-4 times; vacuum-stirring the mixture at ordinary temperature to remove bubbles. In the formula (1), n is an integer of 1,000-2,000. In the formula (2), R1 is -CH3, -CH5, -C6H5, or -CH=CH2, R2 is -H, -CH3, -OCH3, -OC2H5, or -OC3H7, n is an integer of 0-3, m is 0 or 1, R' is H, CH3, C2H5, C3H7, or C6H5, R'' is CH3, C2H5, C3H7, or C6H5. In the formula (3), n is an integer of 10-100.
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