| 摘要 |
PROBLEM TO BE SOLVED: To provide a pad conditioner of a CMP device used in working a semiconductor substrate, capable of improving the working efficiency, and preventing the dropping of diamond abrasive grain and breaking by micron, of a cutting edge. SOLUTION: The diamond abrasive grain is uniformly dispersed and fixed in a state that a ratio occupied by projection area of the diamond abrasive grain to a surface area of a base metal is 30-80%. A projecting amount of the diamond abrasive grain from a plating layer is 3% or more to 50% or less, and the diamond abrasive grain preferably has a crystalline face of the blocky crystalline configuration of hexahedron and octahedron composed of [111] faces and [100] faces. |
