| 摘要 |
The present invention relates to a driver IC packaging module and a parallel plate type display device incorporating the same, and a chassis structure for an IC module having a high heat radiation effect or a flat display device having a high heat radiation efficiency can be achieved. There is provided a driver IC packaging module which comprises a driver IC chip 10 for driving a display electrode 5a of the flat display panel 5, a substrate 11 on which the driver IC chip 10 is mounted, a flexible substrate 12 having output wirings on one end of which connection terminals are provided and on the other end of which output terminals are provided so as to connect electrically at least the display electrode 5a and output pads 10a of the driver IC chip 10, and a structure in which the output pads 10a of the driver IC chip 10 and the connection terminals of the flexible substrate 12 are connected directly and also a direction of exposed surfaces of the output terminals of the flexible substrate 12 connected to the display electrode 5a and a direction of a driver IC chip 10 mounting surface on the substrate 11 are directed oppositely.
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