发明名称 |
BALL GRIP ARRAY CHIP PACKAGES HAVING IMPROVED TESTING AND STACKING CHARACTERISTICS |
摘要 |
A stackable ball grid array (BGA) or fine ball grid array (FBGA) semiconductor package particularly suitable for board-on-chip or chip-on-board applications in which a low profile BGA or FBGA semiconductor package is needed. The stackable ball grid array (BGA) or fine ball grid array (FBGA) provides a semiconductor package that is capable of being burned in and tested in a more efficient and cost effective manner than prior known BGA or FBGA semiconductor packages. A high density, low profile memory module incorporating a plurality of the disclosed BGA or FBGA semiconductor packages in a stacked arrangement is further disclosed. |
申请公布号 |
SG89395(A1) |
申请公布日期 |
2002.06.18 |
申请号 |
SG20010002802 |
申请日期 |
2001.05.11 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
WUU YEAN TAY;JEFFREY TOH TUCK FOOK |
分类号 |
G01R1/04;H01L23/31;H01L25/10;H05K1/18 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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