| 摘要 |
<p>PROBLEM TO BE SOLVED: To see that the multichip module and the hybrid IC of diversified small-quantity production can be produced at a low price stably for a long period, by equipping a preservation container with a metallized pattern being provided, surrounding the area where a bare chip storage and mount is made of the preservation container body, and a sealed part corresponding to it. SOLUTION: For a preservation container body 1, bare chip storages and mounts 3a-3d to store bare chips 2 individually are made on one main surface. Moreover, the metallized pattern 4 is provided surrounding the area where bare chips storage and mounts 3a-3d are made of the preservation container body 1. A weld ring layer 5 made of, for example, kovar is brazed by Ag onto the face of this metallized pattern 4. Furthermore, a cover 7 is equipped with a sealed part 7a corresponding to the metallized pattern 4, and besides seals the bare chip storages and mounts 3a-3d en block.</p> |
