发明名称 METHOD FOR FABRICATING FLASH MEMORY DEVICE
摘要 PURPOSE: A method for fabricating a flash memory device is provided to prevent WSix from being partially oxidized, by forming a doped amorphous silicon layer or passivation layer of amorphous silicon on a semiconductor substrate having a control gate composed of doped polysilicon and WSix and by etching a predetermined portion of the passivation layer to form a contact hole. CONSTITUTION: The control gate(4) is formed on the semiconductor substrate(1) having a predetermined structure. A passivation layer(5) is formed on the control gate. An anti-reflective coating(ARC)(6) is formed on the passivation layer. An insulation layer(7) is formed on the ARC. The contact hole(8) is formed to expose a predetermined portion of the passivation layer. The first metal passivation layer(9) is formed on the resultant structure including the contact hole. A contact plug(10) is formed to fill the contact hole. The second metal passivation layer(11) is formed on the contact plug. A metal line(12) is formed on the resultant structure including the ohmic contact hole.
申请公布号 KR20020044262(A) 申请公布日期 2002.06.15
申请号 KR20000073258 申请日期 2000.12.05
申请人 HYNIX SEMICONDUCTOR INC. 发明人 DONG, CHA DEOK;PARK, SANG UK;PARK, SE HO
分类号 H01L27/115;H01L21/336;H01L21/4763;H01L21/768;H01L21/8247;H01L29/788;(IPC1-7):H01L21/824 主分类号 H01L27/115
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