发明名称 |
METHOD FOR FABRICATING FLASH MEMORY DEVICE |
摘要 |
PURPOSE: A method for fabricating a flash memory device is provided to prevent WSix from being partially oxidized, by forming a doped amorphous silicon layer or passivation layer of amorphous silicon on a semiconductor substrate having a control gate composed of doped polysilicon and WSix and by etching a predetermined portion of the passivation layer to form a contact hole. CONSTITUTION: The control gate(4) is formed on the semiconductor substrate(1) having a predetermined structure. A passivation layer(5) is formed on the control gate. An anti-reflective coating(ARC)(6) is formed on the passivation layer. An insulation layer(7) is formed on the ARC. The contact hole(8) is formed to expose a predetermined portion of the passivation layer. The first metal passivation layer(9) is formed on the resultant structure including the contact hole. A contact plug(10) is formed to fill the contact hole. The second metal passivation layer(11) is formed on the contact plug. A metal line(12) is formed on the resultant structure including the ohmic contact hole.
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申请公布号 |
KR20020044262(A) |
申请公布日期 |
2002.06.15 |
申请号 |
KR20000073258 |
申请日期 |
2000.12.05 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
DONG, CHA DEOK;PARK, SANG UK;PARK, SE HO |
分类号 |
H01L27/115;H01L21/336;H01L21/4763;H01L21/768;H01L21/8247;H01L29/788;(IPC1-7):H01L21/824 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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