| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition from which a film of uniform thickness even to the edge of a wafer can be formed so as to solve such a problem that products are hardly obtained in the corner of a wafer because of the buildup of films on the wafer edge, and to provide a method for manufacturing a pattern by using the above composition. SOLUTION: The photosensitive resin composition contains (a) polymers having the repeating unit expressed by general formula (1) and having monovalent organic groups containing at least one acryloyl group or methacryloyl group and (b) a silicone surfactant consisting of side chain-modified copolymers having Si-C couplings. In formula (1), R1 is a trivalent or tetravalent organic group, R2 is a bivalent organic group, M is a hydrogen atom or monovalent organic group containing acryloyl groups or methacryloyl groups, and n is 1 or 2. |
