| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which has high reliability and is particularly superior in hygroscopicity and high-frequency characteristics, and to provide its manufacturing method. SOLUTION: In this circuit board, a penetration hole formed in the thickness direction of an insulator layer, is filled with via hole conductor, wiring layers having prescribed patterns are formed on both surfaces of the insulator layer, and a part between the wiring layers is connected electrically with the via hole conductor. The insulator layer is constituted of a liquid crystal polymer film, with oriented polymer molecules. |
