| 摘要 |
PROBLEM TO BE SOLVED: To perform a precise die-bonding by preventing breakage of a corner portion of a semiconductor chip without reducing productivity. SOLUTION: An adjustment device 30 adjusts a down-movement distance (a height of bonding) of a chip holder 27 on the basis of each of output of a load cell 25 for detecting a load applied to a upper surface of a bonding stage 23 and a laser displacement gauge 32 for measuring a thickness of a die attachment surface 22a, thereby, a precise die-bonding process is attained by preventing breakage of the corner of the semiconductor chip 26 in loading even if the cut surface of the semiconductor chip 26 is not positioned in a predetermined perpendicularity.
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