| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method which can recycle treatment liquid. SOLUTION: While the back surface of a wafer W is treated by treatment liquid, an intercepting plate 3 is located over the front surface of the wafer W, so that nitrogen gas is fed between the intercepting plate 3 and the wafer W. The intercepting plate 3 is rotated by the Bernoulli's effect, which is caused by the nitrogen gas flowing between the intercepting plate and the wafer W, floating a given distance away from the front surface of the wafer W, synchronizing with the rotation of the wafer W. In this state, the treatment liquid is fed from treatment liquid feeding nozzles 21, 22 to the back of the wafer W.
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