| 摘要 |
PROBLEM TO BE SOLVED: To precisely position a very small semiconductor component to allow right electrical measurement, and satisfactorily cope with high-frequency measurement. SOLUTION: A lead part 1b of the semiconductor component 1 is positioned with respect to a probe 45 inside a measuring instrument 27 just on the instrument 27 using an image processing means. A vacuum suction pipe 47 is provided inside the measuring instrument 27 to suck an underface of the semiconductor component 1, so as to prevent positional shift of the semiconductor component 1 on the measuring instrument 1. Positioning precision is enhanced thereby to allow highly precise measurement even in the semiconductor component of small outside dimension, and the constitution in the periphery of the instrument 27 is simplified to provide an environment capable of coping with the high-frequency measurement.
|
