CUP TYPE PLATING APPARATUS

摘要

PURPOSE: To provide a technology capable of improving a conventional cup type plating apparatus and preventing pollution of a wafer surface by the plating solution mist. CONSTITUTION: In a cup-type plating apparatus in which plating solution is fed to a wafer placed on a wafer support part provided along an upper opening in a plating tank in an upward flow from a solution feed port provided in the bottom part of the plating tank, the plating solution is allowed to flow out of a solution outflow port provided in the plating tank, and the plating is performed while bringing the plating solution into contact with a surface to be plated of the plating wafer. The solution outflow port is provided with a solution outflow passage for separating the out-flowing plating solution from an external space.