发明名称 FLIP CHIP MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flip chip mounting board, which has an joining part excellent in reliability of electrical connections with a flip tip, and a method of manufacturing it. SOLUTION: A flip chip mounting board 5 comprises a terminal part 3 for mounting flip chip 6, where the terminal part 3 comprises: a punched conductive member 2, which is formed by punching a conductive material embedded in an insulation board 7; and a bump, which is joined to the end of the punched conductive member 2 and exposed out of the surface of the insulation board 7, where the bump is a punched bump 1, which is formed by punching a bump forming material.
申请公布号 JP2002170899(A) 申请公布日期 2002.06.14
申请号 JP20000368154 申请日期 2000.12.04
申请人 IBIDEN CO LTD 发明人 TSUKADA KIYOTAKA;NINOMARU TERUMASA
分类号 H05K1/11;H01L21/60;H01L23/12;H01L25/10;H01L25/18;H05K1/18;H05K3/34;H05K3/40;(IPC1-7):H01L23/12 主分类号 H05K1/11
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