发明名称 TRANSMISSION LINE BOARD, HIGH-FREQUENCY TRANSMISSION STRUCTURE AND HIGH-FREQUENCY PACKAGE EQUIPPED THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a transmission line board which is improve in transmission characteristics and capable of reducing a drip caused by resonance without increasing component parts in number. SOLUTION: A transmission line board is equipped with a dielectric board 1, a conductor signal line 2 formed in a line on the top surface of the board 1, plate-like conductor ground planes 3 arranged so as to sandwich the signal line 2 from both sides through the intermediary space, and ground vias 4 which electrically cannot the ground planes 3 to the undersurface of the dielectric board 1. A distance from a virtual reference plane that passes through the center line of the signal line 2 and vertical to the top surface of the board 1 to the center line of the ground vias 4 connected to one of the ground planes 3, and another distance from the above virtual reference plane to the center line of the ground vias 4 connected to the other ground plane 3, are set different from each other.
申请公布号 JP2002171105(A) 申请公布日期 2002.06.14
申请号 JP20000368955 申请日期 2000.12.04
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 KUBO NOBORU
分类号 H05K1/11;H01P1/162;H01P1/212;H01P1/22;H01P3/02;H05K1/02 主分类号 H05K1/11
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