SEMICONDUCTOR DEVICE BONDED BY WIRE WITH SMALL COUPLING CAPACITANCE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device that is connected by elastic bonding wires with small coupling capacitance. SOLUTION: The bonding wires 41 with small self-capacitance and small coupling capacitance for the semiconductor device can be obtained by sheathing wires with a foamed polymer 45 having a very small dielectric constant effectively. Other advantages are obtained by electrically insulating the wire to prevent short-circuit, protecting the wire with sheaths having a small elasticity modulus and by protecting a chip-bonding pad metallization 40.