| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor micro relay of vertical open/close type together with its manufacturing method, which is manufactured in a relatively simple manufacturing process with no constraint on a structure design. SOLUTION: There are provided a semiconductor substrate 1, an insulating layer 7 formed on it, a fixed conductive part 21 formed by plating on the insulating layer 7, a beam-like movable conductive part 31 so formed by plating as to face the fixed conductive part 21 with an interval while electrically separated, a support part 51 which rises above the fixed conductive part 21 to connect to a part of the movable conductive part 31 so that the movable conductive part 31 is physically supported on the substrate 1, and an acting part 8 which, formed on the movable conductive part 31, deflects a part of it in the direction vertical to the surface of the semiconductor substrate 1 so as to be electrically conductive to the fixed conductive part 21. |
