| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board and an electronic device wherein breakdown will not be generated on a solder bump, when an electronic component is operated repeatedly over a long term, and the mounted electronic component can be operated normally over a long term. SOLUTION: In this wiring board, solder bonding pads 2a, 2b are arranged on an insulating substrate 1, and a solder resist layer 3 having aperture parts 3a, 3b from which central parts of the solder bonding pads 2a, 2b are exposed, is stuck on the insulating substrate 1, including outer peripheral parts of the solder bonding pads 2a, 2b. In the solder resist layer 3, the side surfaces of the aperture parts 3a, 3b are spread to the outside at an angle of 60-85 deg. with respect to the surfaces of the solder bonding pads 2a, 2b.
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