| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that cracks on a substrate, deformation in wiring, and deterioration in characteristics easily occur since warpage in the substrate caused by curing contraction in a sealing resin is large in a semiconductor assembly substrate resin sealing body where resin sealing is performed on an assembly substrate having a plurality of circuits mounted onto the surface, and also resin burr adhesion and unfilling generally occur according to the amount of supply resin in the resin sealing using a die. SOLUTION: A hole or a plurality of holes are provided on the assembly substrate, where the hole passes through the circumferential section of the front and back surfaces. The sealing resin body is formed on a surface by a liquid resin, and at the same time a resin body for reinforcement is formed by resin sent onto the back surface through the hole.</p> |
