发明名称 FLOOR HEATING PANEL STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a floor heating panel structure which improves beating efficiency, can be readily set up and reduces the number of processes for setting up. SOLUTION: The structure comprises a flat plate member 1 which is formed to have a given dimensional size and on the upper surface of which a floor material is laid, and a plurality of floor joists 2, etc., which are juxtaposed parallel to a lower surface 1b of the flat member 1. The structure further comprises planar heating elements 3, etc., which are disposed directly or indirectly on the lower surface 1b between the floor joists 2, etc., of the flat member 1, heat storage materials 4, etc., which are disposed on the lower surfaces of the planar heating elements 3, etc., respectively, heat insulating members 5, etc., which are provided in the individual recesses between the floor joists 2, etc., for holding and covering the heat insulating members 4, etc., and the planar heating elements 3, etc., connectors 10, etc., to be electrically connected with the tips of lead wires 9, etc., of the individual planar heating elements 3, etc., and multipoint connectors 12, etc., which are detachably connected to the individual connectors 10, etc.
申请公布号 JP2002168467(A) 申请公布日期 2002.06.14
申请号 JP20000367419 申请日期 2000.12.01
申请人 MITSUBISHI CABLE IND LTD;KANSAI ELECTRIC POWER CO INC:THE 发明人 MATSUOKA TOSHIAKI;OSUMI KATSUMI;KANO AKIRA;HORIUCHI KAZUYA;TAKECHI KEI;KATSURAGAWA SEIGO;KOSHIRAE TAKAHIRO
分类号 E04F15/18;F24D13/02;F24D15/02;F24D19/02;(IPC1-7):F24D13/02 主分类号 E04F15/18
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