| 摘要 |
PROBLEM TO BE SOLVED: To achieve the low-cost manufacturing method of a semiconductor device for collectively forming a circuit for rewiring on a wafer before dividing the semiconductor wafer into chips, for carrying out wire bonding, and for performing dicing for dividing each chip into pieces. SOLUTION: On a metallic plate that is cut in the same shape as the semiconductor wafer, the circuit for rewiring is formed by electrolytic plating as a recess, and the circuit for rewiring is heated and pressurized for laminating so that the circuit is buried in a light-sensitive insulating resin layer. After that, merely the metallic plate is subjected to etching elimination, and iteration is made corresponding to each chip on the wafer for forming the circuit for rewiring. Additionally, by the photolithography method, an opening for wire bonding is provided, and a pad on the chip and a bond finger are collectively subjected to wire bonding via the opening, and dicing is carried out for dividing each chip into pieces. |
