发明名称 MULTI-LAYERED FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To form a multi-layered flexible wiring board which does not have deformations, such as curvature and stripes. SOLUTION: This multi-layered flexible wiring board 1 is provided with a corrugated part 35 at the edge part of a 2nd flexible substrate element piece 20 constituting the border between a laminated part 36, where the 2nd flexible substrate element piece 20 is present and an exposed part 37 where the 2nd flexible substrate element piece 20 is absent on the top surface of a 1st flexible substrate element piece 10. Therefore, when the 1st and 2nd flexible substrate element pieces 10 and 20 are heated and pressed for connection, the corrugated part reduces the stress operating on the border between the laminated part 36 and exposed part 37 and the obtained multi-layered flexible wiring board 1 has neither a curved nor a striped deformed part on its top surface.
申请公布号 JP2002171063(A) 申请公布日期 2002.06.14
申请号 JP20000366675 申请日期 2000.12.01
申请人 SONY CHEM CORP 发明人 ANZAI YUKIO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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