发明名称 METHOD AND TOOL FOR MANUFACTURING DIAMOND STRUCTURE BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a diamond structure body where a bonding layer has stable bond properties, and to provide a tool used for manufacturing the diamond structure body. SOLUTION: In this method for manufacturing the diamond structure body, a metallization layer 42 is formed on a diamond substrate, a laser is used for cutting the diamond substrate, a conductive deterioration layer generated on the cut surface is removed, the bonding layer 43 is formed on the upper surface of the metallization layer 42, and the diamond structure body is manufactured. Also, in the manufacturing method, a diamond substrate is inserted into the tool 100 for manufacture, thus uniformly forming the bonding layer 43 with fixed thickness merely on the upper surface of the metallization layer 42.
申请公布号 JP2002170913(A) 申请公布日期 2002.06.14
申请号 JP20000368598 申请日期 2000.12.04
申请人 TOYO KOHAN CO LTD 发明人 OKADA MITSUHARU;NIKA MICHIFUMI;TAKAGI KENICHI
分类号 H01L23/40;H01L23/373;(IPC1-7):H01L23/40 主分类号 H01L23/40
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