发明名称 METHOD FOR FABRICATING SHALLOW TRENCH ISOLATION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a method for fabricating a shallow trench isolation structure, by which the formation of a recess at the upper corner portion of the shallow trench isolation structure can be effectively prevented by protecting the upper corner portion of the shallow trench isolation structure. SOLUTION: A pad oxide layer and a mask layer are continuously formed on a substrate. A trench is formed by patterning a portion of the pad oxide layer and the mask layer. A liner layer is formed on the exposed face of the substrate including a silicon surface exposed in the trench of the substrate, on the sidewall of the pad oxide layer, and on the sidewall and the surface of the mask layer. A planarization process is carried out until the mask layer is exposed after the trench is filled with oxide layer by depositing over the trench and the substrate. The shallow trench isolation structure is completed by removing the mask layer and the pad oxide layer.
申请公布号 JP2002170878(A) 申请公布日期 2002.06.14
申请号 JP20010041435 申请日期 2001.02.19
申请人 UNITED MICROELECTRONICS CORP 发明人 SO KASHU;RIN KENTEI;KO KENCHO
分类号 H01L21/76;H01L21/316;(IPC1-7):H01L21/76 主分类号 H01L21/76
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