发明名称 APPARATUS FOR MOLDING ELECTRONIC COMPONENT LOADED ON HOOP FRAME AND ITS MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To elevate efficiency of mold press by controlling to make a portion to be molded the shortest without pressing a joint position of a hoop frame. SOLUTION: A detector means 5 detects the joint 2a of the hoop frame. When the joint 2a is detected, a controller means 8 controls so that the portion L1 to be molded between a position of the joint 2a and a position molded just before by a molding means 4 is mold-pressed. When the portion L1 to be molded is mold-pressed, the controller means 8 controls a transferring means 31 and a molding means 4 so that the position of the joint 2a is located outside of the molding means 4. Thus, by the controller means 8, the efficiency of an electronic-component molding operation can be increased and a waste of hoop frame can be controlled to a minimum.
申请公布号 JP2002170835(A) 申请公布日期 2002.06.14
申请号 JP20000363380 申请日期 2000.11.29
申请人 SHIBAURA MECHATRONICS CORP 发明人 SHIMA TOSHIHIRO
分类号 B29C45/14;B29C45/76;H01L21/50;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/14
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