| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability between via hole conductor, formed by a method wherein the inside of a via hole is filled with a metallized paste, and a wiring circuit layer constituted of a metal foil. SOLUTION: A wiring board is provided with a ceramic-insulating board 1, the wiring circuit layer 2 which is formed on a surface of the insulating board 1 and constituted of the metal foil, and the via hole conductor 3 formed by a method, where the inside of the via hole of the insulating board 1 is filled with metal powder. In the wiring board, the via hole conductor 3 and the wiring circuit layer 2 constituted of the metal foil are connected via a metallized layer 4, formed by baking the metallized paste.
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