| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of water content permeating from a gap formed, between a surface wiring layer and an insulating base substance and corrosion being generated on a connection interface between the surface wiring layer and an inner wiring layer. SOLUTION: In a wiring board 5, the surface wiring layer 2 and the inner wiring layer 3 consists of tungsten and/or molybdenum and copper. The surface wiring layer 2 is formed on a surface of the insulation base substance 1, the inner wiring layer 3 is formed inside the base substance 1, and the surface wiring layer 2 and the inner wiring layer 3 are connected. An intermediate layer 6, consisting of tungsten and/or molybdenum and iron group metal, is arranged on the connection interface between the surface wiring layer 2 and the inner wiring layer 3. |
