| 摘要 |
PROBLEM TO BE SOLVED: To increase the accuracy, film-thickening and reliability of an insulator layer for forming a soldering dam, in the substrate for mounting optical parts that is used inside an optical module and that is for mounting a light emitting element, a light receiving element and an optical waveguide on the same substrate with the purpose of mounting an optical semiconductor element through self-alignment of solder. SOLUTION: The substrate S1 for mounting optical parts is characterized by the formation with an opening 15 for arranging the optical semiconductor element on a base plate 9 and with a loading groove 6 for arranging the optical waveguide that is to be optically connected to the element. The opening 15 is constituted by that the first insulator layer 1 formed on the surface of the base plate 9 is successively formed with a second and a third insulator layers 3a, 3b through a conductor layer 2. The loading groove 6 is also successively laminated with the fist and the third insulator layer 1, 3b on the upper peripheral edge. |
