THIN FILM HEAT SINK AND METHOD OF MANUFACTURE

摘要

PROBLEM TO BE SOLVED: To provide a thin film heat sink having high heat conductivity, satisfactory adhesion to a substrate and low internal stress and to provide its manufacturing method. SOLUTION: The thin film heat sink has a heat sink film 52 having a heat sink function and a bonding film 51 for bonding the heat sink film 52 to the substrate 50. The bonding film 51 consists of an aluminum oxide (Al2O3) film formed by a CVD method and the heat sink film 52 consists of an aluminum nitride(AlN) film. The internal stress of the AlN film as the heat sink film 52 acts as compressive stress and the internal stress of the Al2O3 film as the bonding film 51 acts as tensile stress.