发明名称 HOUSING STRUCTURE FOR BOARD
摘要 PROBLEM TO BE SOLVED: To provide a housing structure for a board at a low cost which is not liable to separation of a case body from a case cover and having a fixing means of a printed board. SOLUTION: Semiconductor recess 13a and 13b of a board 14 of a printed board 2 are disposed on a stepwise surfaces 7a and 7b, made of substantially semiconductor cutout end faces of mounting holes 6a and 6b of the case body 3, so as to be coaxial with the holes 6a and 6b, and ends of cutouts 23a and 23b of the board 14 are contacted with rising surfaces 8a and 8b the stepwise surfaces 7a and 7b. Since directions of the surfaces 8a and 8b to the board 14 are different from each other, the board 2 becomes a structure strong against vibration, a deviation or the like in a parallel direction with respect to the surface of the board, and a position of the parallel direction to the surface of the board can be fixed.
申请公布号 JP2002171083(A) 申请公布日期 2002.06.14
申请号 JP20000363453 申请日期 2000.11.29
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SAKO HIROYUKI;YAMAZAKI SHIGEAKI;IMAOKA YOSHIHIDE;SHIMIZU SATOO
分类号 H05K5/00;H05K7/14;(IPC1-7):H05K7/14 主分类号 H05K5/00
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