| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows vias to be located apart from active elements without increasing the ground inductance of the active elements, thereby improving the manufacturing yield and the reliability. SOLUTION: First conductors 106, 107 of a slot line are connected to an input and output terminals 104, 105 of an active element 101, and second conductors 103 of the slot line are connected to a common terminal 102 of the element 101. Opposite connections 108, 108 of the slot line to the active element 101 connect first ends of signal conductors 109, 110 of a microstrip line to the first conductors 106, 107 of the slot lines, and ground conductors of the microstrip line are connected to second conductors 103 of the slot lines through vias 111, 111 passing through a semiconductor substrate 114. |
