发明名称 SURFACE TREATMENT DEVICE AND SURFACE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method for uniformly treating surfaces. SOLUTION: One side of a cylinder-like reaction tube 4 is opened as a spouting hole 5. A plurality of electrodes 6 and 7 are disposed around the outer surface of the reaction tube 4. Plasma 3 is generated in the reaction tube 4 by applying a voltage between the electrodes 6 and 7, under the pressure close to atmospheric pressure. The surface treatment method includes surface treatment on works 1, in which the plasma 3 generated in the reaction tube 4 is blown out from the blow out port 5, onto the surface of works 1. Making at least one of the reaction tube 4 or the works 1 move approximately horizontal against the surface of the works 1, and by making the works 1 turn or revolute, plasma 3, from the blow out hole 5, is blown onto the surface of the works 1. Thus, plasma 3 can be supplied onto the entire surface of the works 1 almost evenly.
申请公布号 JP2002170815(A) 申请公布日期 2002.06.14
申请号 JP20000367092 申请日期 2000.12.01
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ARAI TAKAFUMI;TANAKA NOBORU;SAWADA KOJI
分类号 H05H1/46;G03F7/40;H01L21/027;H01L21/302;H01L21/304;H01L21/3065 主分类号 H05H1/46
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