| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized pressure sensor module. SOLUTION: Among three chips, that is, a semiconductor pressure sensor part 1 having a diaphragm part 1a displaceable by pressure and having the function of detecting the pressure based on the displacement of the diaphragm part 1a, an IC part 2 having the function of controlling the sensor part 1, and a ROM mounting part 3 having the trimming function of correcting the characteristics of the sensor part 1, two chips excluding a chip having an electrical connection part are mounted so that the outside dimension of the surface of the latter falls within the dimension of the largest chip, and the sensor part 1 is mounted so that the diaphragm part 1a of the sensor part 1 is displaced by the pressure from a first pressure inlet hole 9a.
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