| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a high degree of freedom for arrangements of circuit elements by eliminating a restriction on arrangements of circuits. SOLUTION: This semiconductor device possesses external terminals (61), first and second internal circuits (51, 52) that are connected to the external terminals, and wiring (62) that connects the external terminals, and the first and the second internal circuits. The wiring is formed on an insulating layer that covers a wiring layer provided on a semiconductor chip surface and is formed by a conductive layer that contacts electrodes of the wiring. The first and the second internal circuits are arranged to be separated by a distance. |
