发明名称 METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component, capable of efficiently mounting the component on a board of the same mounting stage by a plurality of transfer heads, having a plurality of suction nozzles. SOLUTION: The method for mounting the electronic component comprises the steps of imaging the component by a camera intrinsic for each transfer head, recognizing each component by a common image processing means, and then mounting the component on the board. The method further comprises the steps of previously setting, excluding conditions for executing starting the recognition of the image, after capturing of the image of the component of one transfer head is finished, starting image capturing of the component held at another transfer head and recognizing the component of another transfer head, after the recognition of the component of the one transfer head is finished. Thus, a complication of the operating sequence of the plurality of the transfer heads is prevented, programming can be facilitated, and an efficient electronic component mounting can be realized.
申请公布号 JP2002171095(A) 申请公布日期 2002.06.14
申请号 JP20000366687 申请日期 2000.12.01
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SUMI HIDEKI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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