| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a high-frequency module substrate constituting such a transmitting circuit section that can realize mobile communication equipment which is less in loss, has a small size, and can be manufactured inexpensively. SOLUTION: This high-frequency module substrate has power amplifying sections AMP1 and AMP2 and/or a high-frequency switch SW, and couplers COP1 and COP2 which are used for monitoring high-frequency input signals from the amplifying sections AMP1 and AMP2. The couplers COP1 arid COP2 have main strip lines 33 through which the high-frequency input signals are transmitted, auxiliary strip lines 37 which are electromagnetically coupled with the lines 33, and terminating resistors 35 which are connected to one ends of the lines 37 and mounted on the surface of the substrate. The other ends of the auxiliary strip lines 37 are connected to the end-face electrodes 65 of the substrate.</p> |
