| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for built-up, a resin film with a carrier, and a built-up multi-layered printed wiring board which have superior heat resistance, moisture resistance, and anticorrosiveness, without causing hydrogen bromide to be generated as poisonous gas in combustion. SOLUTION: This resin composition for buildup contains (A) thermoplastic resin or thermosetting resin of >=10,000 in weighted mean molecular weight, (B) phosphorus-containing epoxy resin having 9,10-dihydro-9-oxa-10- phosphaphenanthrene-10-oxide or its derivative as a reaction component, (C) silicone powder, (D) an inorganic filler, (E) a hardener, and (F) a hardening accelerating agent as essential components and so that the thermoplastic resin or thermosetting resin of (A) is 5 to 80 wt.% of the total weight of (A) to (F) and is applied to buildup of a multi-layered printed wiring board. |
