| 摘要 |
PROBLEM TO BE SOLVED: To reduce a mounting area by reducing the size of a solder fillet. SOLUTION: The surface of an anode element which is provided with an anode lead wire 4 and is made of valve action metal is successively laminated with a dielectric oxide film, an electrolyte layer, and a cathode layer, and its outer circumference is formed of cathode layer. Such a capacitor element 2 is mounted to a lead frame 11, and an exterior facing resin 3 is formed covering the capacitor element 2. Then a specified area including the capacitor element 2 is cut out from the lead frame 11 to make a chip-type solid electrolytic capacitor 1 having a specified shape. In this case, the lead frame 11 uses a material having a poor solder adhesive strength, and a metallic layer 14 superior in solder adhesive strength is formed in a specified portion of an anode terminal 5 and a cathode terminal 6 in the lead frame 11.
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