Interconnect system for electronic packages

摘要

An interconnect system for a butterfly package e.g. a laser package is provided on at least one feedthrough wall of the package through which extends a plurality of electrical connectors. A ceramic or glass circuit block is disposed on the inner side of the wall or of a feedthrough insert. The circuit block has an insulating surface and an electrical circuit disposed on said surface, the circuit being in electrical connection with at least some of the electrical connectors. The block abuts the electrical connectors on the inner side of the feedthrough wall to provide a support for the connectors.