发明名称 Cellular phone housing
摘要 There is provided a cellular phone housing formed with a base made of a resin material by molding, wherein the base is coated with a metal multiplayer including a lower metal layer formed on a surface of the base with metal plating and an upper metal layer formed on the lower metal layer with metal plating, and wherein the lower metal layer is made of a first metal which is ductile and the upper metal layer is made of a second metal which is brittle compared with that of the first metal.
申请公布号 US2002072335(A1) 申请公布日期 2002.06.13
申请号 US20010011032 申请日期 2001.11.13
申请人 NEC CORPORATION 发明人 WATANABE YOHSUKE
分类号 H05K5/02;C25D5/12;C25D5/56;C25D7/00;H04M1/02;H04M1/18;(IPC1-7):H05K5/00;H04B1/38 主分类号 H05K5/02
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