| 摘要 |
<p>A container and a method for transferring a substrate; the container for transferring the substrate formed mainly of a material with a water absorption of 0.1% or less and used for receiving and storing or transferring the substrate suitably in a production process for semiconductor chip formed by the combination of copper wiring with, so-called, low permittivity insulation film of 3 or less in permittivity, comprising a container body, a door capable of closing the container body, and a conductive part coming into contact directly or indirectly with the substrate and allowing static electricity to lead to the outside thereof; the method for transferring the substrate between a plurality of processes, comprising the steps of taking the substrate into the transfer container from the atmosphere of a first process, circulating the gas selectively excluding at least one of moisture, particulate matter, and chemical substances intermittently or continuously in the container to keep exposing the substrate to the gas, and leading the substrate from the container to a second process.</p> |
