A heat dissipation device that includes a conduit in a base portion thereof. An opening extends from a dissipation surface of the base portion to a conduit. The conduit allows air from a fan to flow within the base portion, which can improve heat removal from hotspots, and alleviate air stagnation in the heat dissipation device.
申请公布号
WO0247451(A2)
申请公布日期
2002.06.13
申请号
WO2001US44163
申请日期
2001.11.06
申请人
INTEL CORPORATION (A DELAWARE CORPORATION);SEARLS, DAMION, T.;DISHONGH, TERRACE, J.;DUJARI, PRATEEK;LIAN, BIN
发明人
SEARLS, DAMION, T.;DISHONGH, TERRACE, J.;DUJARI, PRATEEK;LIAN, BIN