Testing device for parallel testing of IC's, has active bus module inserted in signal path between test system and tested IC

摘要

The testing device has a carrier plate (124) receiving electrical signal lines of a test system and contact needles (150) for providing electrical connections with contact surfaces of the tested IC's (160a,160b). The carrier plate has active bus modules (120,121) for each tested IC, inserted in the signal path between the electrical signal lines of the test system and the tested IC.